Description
FemtoTGV is a laser micromachining workstation optimized for Through Glass Vias (TGV) fabrication.
The most used method for glass core substrate processing while creating TGVs is laser fabrication, combined with a wet etch process. Our FemtoTGV is dedicated for laser fabrication part.
WOP has been dedicated to mastering the laser micromachining of glass substrates for over a decade and has developed process technologies and equipment that are suitable for high aspect ratio through glass vias across a variety of glass types, diverse via configurations (including hourglass, straight, and tapered vias), and different etching capabilities by utilizing various chemistries.
WOP TGVs parameters:
- Roundness: >95%
- Waist: Borosilicate >90%, Alkali-free >75% (with deviation of ±3%)
- Diameter tolerance: ±3%
- Accuracy: ±1 μm, (<5 μm per 515×510 mm panel)
- Roughness: Rz <1 μm
- Yield: 100%
- Taper: taperless, hourglass
FemtoTGV technical specifications
| Parameter |
Value |
| Glass compatibility |
BF33, D263t, EXG, SG 7.8 , SG 3.4, EN-1A, OA-11 |
| Laser |
High power ultrashort pulse IR |
| Optical beam delivery |
WOP patented optical beam delivery engine |
| Samples size |
Laboratory: up to 300×300 mm
Industrial: up to 600×600 mm |
| Positioning system |
XYZ mechanical axes, positioning accuracy ±0.5 μm featuring continuous wafer level patterning |
| Vision |
Real-time visualization and positioning camera with feature recognition |
| Metrology |
Compactable with AOI |
| Sample handling |
Manual | semi automatic | automatic |
| Optical pulse detection function |
Miss fire detection or Low energy detection |
| Fume extraction system |
Included |
| Accessories |
Power control, polarization state control |
| Software |
Entire system control via single GUI developed by WOP |
| Supported file formats |
– 2D/3D model import: STL, DXF, DWG, AMF, PLT, FAB
– Bitmap support: BMP, GIF, JPG, JPEG, PNG
– Text files as a table array: TXT, RTF, TEX |
| Construction |
Granite base with passive / active vibration control |